Ultra-low-melting point glass

This is lead-free, RoHS-compliant glass powder and paste that can be sealed at low temperatures. It is used to seal electronic parts, mainly semiconductor parts.
While being compliant with RoHS, Central Glass ultra-low melting point lead-free glass can be fired at temperatures of less than 400°C.
Also, the coefficient of thermal expansion can be controlled by the addition of inorganic fillers, so it can be used with a wide variety of base materials.

*Contact Central Glass directly for more information.

Characteristics

  MS series
Softening point [℃] 300~350
Transition point [℃] 270~320
Coefficient of thermal expansion [×10-7/K] 80~150
Recommended firing conditions Peak temperature : 350-400℃

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